Tribological behavior of high-performance polymers used in wafer production systems for enhanced efficiency

This study investigates the tribological performance of 6061-T6 aluminum alloy and high-performance polymers (polyoxymethylene copolymer (POM-C), polytetrafluoroethylene (PTFE), polyamide-6 (PA-6), and cast polyamide-6 (PA-6G)) under dry sliding conditions, with a focus on their suitability for wafer machinery components. Tribological tests, conducted using a UTS 10/20 top-disk tribometer, evaluated the materials' coefficients of friction (COF) and wear resistance. PA-6G exhibited the lowest COF (0.16) and wear rate, demonstrating exceptional frictional and wear properties. This exceptional performance can be attributed to the polymer's unique molecular structure, which promotes a low-friction interface and enhances its wear resistance. PA-6 also showed strong performance, balancing durability, and moderate frictional resistance. PTFE displayed low friction (COF = 0.28), suitable for continuous motion systems, though its moderate wear resistance limits applications under severe conditions. POM-C offered a balanced performance but showed a higher COF (0.34). Conversely, 6061-T6 alloy exhibited significant abrasive wear and the highest wear rate (1.13 × 10⁻³ mm³/Nm), highlighting the need for surface enhancements in high-wear environments. These findings provide critical insights into material selection for wafer machinery components, emphasizing PA-6G's potential to enhance operational efficiency and equipment longevity through superior tribological performance. Highlights: PA-6G offers the lowest COF (0.16) and superior wear resistance among tested materials. 6061-T6 exhibits significant wear, necessitating surface treatments for improved durability. PTFE ensures low friction (COF = 0.28) but shows moderate wear resistance under sliding. PA-6 balances low COF (0.22) and high wear resistance, ideal for durable applications. The findings suggest that optimized material selection could enhance the operational efficiency and reliability of wafer machinery components.