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Transient thermal response of servers through air temperature measurements

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıbilirkişi

14 Atıf (Scopus)

Özet

Transient CFD analysis of data centers requires appropriate representations of the transient thermal characteristics of servers. Thermal conductance and thermal capacitance are two determining characteristics for the response of servers under unsteady conditions. Previous studies proposed tests that require detailed temperature and thermal capacitance measurements for each of the server component, requiring access to individual components inside the server. In this paper, we propose a method for obtaining the transient thermal characteristics of a server from server inlet and outlet temperatures under transient operating conditions.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI'lar
Yayın durumuYayınlandı - 2013
Harici olarak yayınlandıEvet
EtkinlikASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Süre: 16 Tem 201318 Tem 2013

Yayın serisi

AdıASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Hacim2

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???event.eventtypes.event.conference???ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Ülke/BölgeUnited States
ŞehirBurlingame, CA
Periyot16/07/1318/07/13

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