The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

Semih Dogu, Hadi Alidoustaghdam, Ismail Dilman, Mehmet Nuri Akinci

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3 Atıf (Scopus)

Özet

In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıProceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
EditörlerArturs Aboltins, Anna Litvinenko
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
Sayfalar76-81
Sayfa sayısı6
ISBN (Elektronik)9781728193984
DOI'lar
Yayın durumuYayınlandı - 1 Eki 2020
Etkinlik2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020 - Virtual, Riga, Latvia
Süre: 1 Eki 20202 Eki 2020

Yayın serisi

AdıProceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020

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???event.eventtypes.event.conference???2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
Ülke/BölgeLatvia
ŞehirVirtual, Riga
Periyot1/10/202/10/20

Bibliyografik not

Publisher Copyright:
© 2020 IEEE.

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