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Scattering by a Dielectric Circular Cylinder in a Planar Layered Medium with MAS, MMP and T-Matrix Methods

  • Mehmet Emin Geçer*
  • , Murat Enes Hatipoǧlu
  • , Kamil Karaçuha
  • , Aytaç Alparslan
  • , Fatih Dikmen
  • , Vasil Tabatadze
  • *Bu çalışma için yazışmadan sorumlu yazar

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıbilirkişi

Özet

An investigation on TM line source excitation of a dielectric circular cylinder in a dielectric slab is performed using three approaches: Method of Auxiliary Sources, Multiple Multipoles Method and T-Matrix Method. In this work particularly, the first involves the slab and scatterer boundaries while the next two uses two different approaches to Green's function of Planar Layered Medium in two dimensions focusing only on the scatterer boundary. The comparison of the tangential total fields on the scatterer from these three methods are obtained in good agreement. Their deviations are discussed addressing the modelling strategies of the methods used as the cause of deviations observed projecting the stronger side of each method.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığı2025 IEEE 30th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED 2025 - Proceedings
YayınlayanIEEE Computer Society
Sayfalar14-18
Sayfa sayısı5
ISBN (Elektronik)9798331588144
DOI'lar
Yayın durumuYayınlandı - 2025
Etkinlik30th IEEE International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED 2025 - Tbilisi, Georgia
Süre: 8 Eyl 202510 Eyl 2025

Yayın serisi

AdıProceedings of International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED
ISSN (Basılı)2165-3585
ISSN (Elektronik)2165-3593

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???event.eventtypes.event.conference???30th IEEE International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory, DIPED 2025
Ülke/BölgeGeorgia
ŞehirTbilisi
Periyot8/09/2510/09/25

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© 2025 IEEE.

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