Parameter estimation for lumped capacitance modeling of crah units during chilled water interruption

Hamza Salih Erden, H. Ezzat Khalifa

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıbilirkişi

5 Atıf (Scopus)

Özet

Lumped capacitance models have been introduced to study transient thermal response of data centers. Chilled water interruption of a Computer Room Air Handling (CRAH) unit is one of several failure scenarios of data center cooling infrastructures. In such a scenario, predicting the transient thermal response of the CRAH unit depends requires the determination of the CRAH lumped capacitance model parameters: The thermal capacitance (thermal mass) and the time constant. In this paper, we propose an experimental methodology to extract sufficient information for the lumped capacitance modeling of CRAH units. The method requires measurements of inlet and exit air temperature, air flow rate and CRAH fan power. If the chilled water supply to a CRAH unit is intentionally interrupted in a data center with multiple redundant CRAH units, sufficient information to estimate the CRAH lumped capacitance parameters can be obtained without disturbing the data center operation.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıThermal Management
YayınlayanAmerican Society of Mechanical Engineers
ISBN (Elektronik)9780791856888
DOI'lar
Yayın durumuYayınlandı - 2015
Harici olarak yayınlandıEvet
EtkinlikASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, United States
Süre: 6 Tem 20159 Tem 2015

Yayın serisi

AdıASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Hacim1

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???event.eventtypes.event.conference???ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Ülke/BölgeUnited States
ŞehirSan Francisco
Periyot6/07/159/07/15

Bibliyografik not

Publisher Copyright:
Copyright © 2015 by ASME.

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