Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Thamer Khalif Salem*, Ferina Saati Khosroshahi, Mehmet Arık, Mohammad O. Hamdan, Mete Budakli

*Bu çalışma için yazışmadan sorumlu yazar

Araştırma sonucu: Dergiye katkıİnceleme makalesibilirkişi

12 Atıf (Scopus)

Özet

Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.

Orijinal dilİngilizce
Sayfa (başlangıç-bitiş)1-13
Sayfa sayısı13
DergiExperimental Heat Transfer
Hacim32
Basın numarası1
DOI'lar
Yayın durumuYayınlandı - 2 Oca 2019
Harici olarak yayınlandıEvet

Bibliyografik not

Publisher Copyright:
© 2017, © 2017 Taylor & Francis.

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