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IoT module improves smart environment reliability

  • Istanbul Technical University

Araştırma çıktısı: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıHakem

1 Atıf (Scopus)

Özet

Many mission critical infrastructure systems directly impact the longevity and the usefulness of the systems they support. Heating and cooling equipment (HVAC) are important support equipment for sensitive industrial systems including manufacturing, IT, high tech testing and measuring equipment. Therefore it is important to monitor functionality and health of this sensitive equipment. Moreover, it is critical to track failures in these systems as they are indicative of future outages of the supported systems. In this paper, we present an IoT based module that monitors the heating cooling element. The module can detect outages in HVAC equipment and notify operators about the sensitive system failures following these events. The module has been deployed to find that it detects the system failures can relay this information to operators to act timely. Therefore, improves the system reliability. Moreover, the module can support logging of HVAC equipment as well as supported sensitive equipment power usage to generate usage patterns and allow operators identify key trends and potential problems.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıRTSI 2017 - IEEE 3rd International Forum on Research and Technologies for Society and Industry, Conference Proceedings
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
ISBN (Elektronik)9781538639061
DOI'lar
Yayın durumuYayınlandı - 11 Eki 2017
Etkinlik3rd IEEE International Forum on Research and Technologies for Society and Industry, RTSI 2017 - Modena, Italy
Süre: 11 Eyl 201713 Eyl 2017

Yayın serisi

AdıRTSI 2017 - IEEE 3rd International Forum on Research and Technologies for Society and Industry, Conference Proceedings

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???event.eventtypes.event.conference???3rd IEEE International Forum on Research and Technologies for Society and Industry, RTSI 2017
Ülke/BölgeItaly
ŞehirModena
Periyot11/09/1713/09/17

Bibliyografik not

Publisher Copyright:
© 2017 IEEE.

Finansman

ACKNOWLEDGEMENT We acknowledge the generous support from Turk Telekom Corporation and Turk Telekom Labs.

Finansörler
Turk Telekom Corporation
Turk Telekom Labs

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