Özet
Purpose: In this study, we propose a novel cooling dehumidifying strategy, in which a condensing panel can be hydronically connected in series with the radiant cooling system to overcome condensation risk and improve indoor thermal comfort level. Based on the concept, the sensible heat-load is primarily covered by radiant cooling panels and some amount of latent heat and sensible heat can be treated by the condensing panel, while improving indoor thermal comfort level. Since, the surface temperature of the condensing panel is lower than the dew point temperature, while the radiant surface is higher for same supply water temperatures – condensation occurs only over the condensing panel. Theory and Methods: This paper evaluates the thermal comfort performance of the proposed novel condensing panel. For these aim, a new experimental chamber was developed. General thermal comfort level and the temperature, relative humidity ratio distribution in the tested room were evaluated for 10 different experimental cases. Multiple tests were conducted by varying surface temperature of the condensing panel and initial relative humidity ratios of air in the room. Results: In all studied cases, thermal comfort conditions were provided. The elapsed time to reach the thermal comfort conditions was associated with the initial PMV value and panel humidifying capacity. The elapsed time to reach the thermal comfort conditions was 360 min for the case, where the initial room humidity ratio was 75 % and panel surface temperature was 10.5 °C, while this value was 480 min for the case where the initial room humidity ratio was 85 % and panel surface temperature was 10.5 °C. In all experimental cases, PMV value decreased logarithmically. The results showed that, maximum dehumidifying capacity was seen in the first 30 min of the experiments. Due to the decrease in the average room temperature and relative humidity ratio of air over the time, dehumidifying capacity of the panel also decreased. Conclusion: The results show that proposed simple solution can improve thermal comfort level, for the places where the latent heat loads are not considerable high, and reduce the condensation risk over the radiant cooling panels.
| Tercüme edilen katkı başlığı | A new method that can be used to overcome the condensation risks in radiant cooling systems and thermal comfort examinations |
|---|---|
| Orijinal dil | Türkçe |
| Sayfa (başlangıç-bitiş) | 1055-1072 |
| Sayfa sayısı | 18 |
| Dergi | Journal of the Faculty of Engineering and Architecture of Gazi University |
| Hacim | 33 |
| Basın numarası | 3 |
| DOI'lar | |
| Yayın durumu | Yayınlandı - 2018 |
| Harici olarak yayınlandı | Evet |
Bibliyografik not
Publisher Copyright:© 2018 Gazi Universitesi Muhendislik-Mimarlik. All rights reserved.
Finansman
This work was supported by the Scientific and Technological Research council of Turkey (TUBITAK). The study was a part of the TUBITAK 3001 project with the number of 213M199
| Finansörler | Finansör numarası |
|---|---|
| TUBITAK | |
| Türkiye Bilimsel ve Teknolojik Araştirma Kurumu | 213M199 |
Keywords
- Condensing panel
- Radiant cooling
- Thermal comfort
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