Genetic Algorithm Optimization Applied to the Design of a Novel Arc-Truncated and Slotted Cylindrical Equilateral Triangular Microstrip Antenna on a Suspended Substrate

Mahmud Esad Yigit*, Tayfun Gunel

*Bu çalışma için yazışmadan sorumlu yazar

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Özet

In this paper, genetic-based design of a novel equilateral triangular microstrip antenna on a cylindrical surface has been presented. Aim of the design is to obtain an antenna which operates in the frequency range between 3.4 GHz and 3.8 GHz for 5G mobile communication systems. Firstly, a conventional equilateral triangular microstrip antenna on a cylindrical dielectric substrate is designed. Then, arc-truncation of the antenna tips and slot are introduced to the antenna on a suspended substrate to obtain resonant frequency in the desired interval and increases in the gain and bandwidth of the antenna. In order to obtain geometric values of the slot sizes, thickness of the air gap, width of microstrip line feed and radii of arc-truncations that give the desired performance of the antenna, Genetic Algorithm in the optimization tool of ANSYS High Frequency Structure Simulator (HFSS) has been used. As a result resonant frequency has been obtained in the desired frequency range and increases in gain and bandwidth of a novel antenna have been observed from the simulation results obtained via HFSS.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığı2023 Innovations in Intelligent Systems and Applications Conference, ASYU 2023
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
ISBN (Elektronik)9798350306590
DOI'lar
Yayın durumuYayınlandı - 2023
Etkinlik2023 Innovations in Intelligent Systems and Applications Conference, ASYU 2023 - Sivas, Turkey
Süre: 11 Eki 202313 Eki 2023

Yayın serisi

Adı2023 Innovations in Intelligent Systems and Applications Conference, ASYU 2023

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???event.eventtypes.event.conference???2023 Innovations in Intelligent Systems and Applications Conference, ASYU 2023
Ülke/BölgeTurkey
ŞehirSivas
Periyot11/10/2313/10/23

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Publisher Copyright:
© 2023 IEEE.

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