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Enhancing Hyperspectral and Multispectral Image Fusion Using High Dimensional Model Representation

  • Efe Kahraman*
  • , Suha Tuna
  • *Bu çalışma için yazışmadan sorumlu yazar

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıbilirkişi

1 Atıf (Scopus)

Özet

Hyperspectral imagery provides valuable information on reflective surfaces through its rich spectral content. However, it inherently suffers from low spatial resolution, as achieving high spatial detail requires a strong signal-to-noise ratio. Hyperspectral and multispectral image fusion is employed to generate images with high spectral and spatial resolution to address this limitation. In this study, Coupled Non-negative Matrix Factorization (CNMF) is taken into focus. We propose an efficient fusion method that integrates High Dimensional Model Representation (HDMR) with CNMF, which significantly outperforms the plain CNMF in terms of peak signal-to-noise ratio (PSNR), structural similarity index measure (SSIM), and mutual information (MI). Experiments are conducted in various hyperspectral and multispectral image dataset. It is observed that, compared to the fused images obtained from CNMF, the proposed method improves PSNR by up to 12 dB, SSIM by up to 0.70, and MI by up to 0.30.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıISAS 2025 - 9th International Symposium on Innovative Approaches in Smart Technologies, Proceedings
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
ISBN (Elektronik)9798331514822
DOI'lar
Yayın durumuYayınlandı - 2025
Etkinlik9th International Symposium on Innovative Approaches in Smart Technologies, ISAS 2025 - Gaziantep, Turkey
Süre: 27 Haz 202528 Haz 2025

Yayın serisi

AdıISAS 2025 - 9th International Symposium on Innovative Approaches in Smart Technologies, Proceedings

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???event.eventtypes.event.conference???9th International Symposium on Innovative Approaches in Smart Technologies, ISAS 2025
Ülke/BölgeTurkey
ŞehirGaziantep
Periyot27/06/2528/06/25

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Publisher Copyright:
© 2025 IEEE.

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