Effect of Viscous Damping Coefficient on Suppression of Structural Earthquake-Induced Vibrations with Tuned Liquid Column Dampers

Sefer Arda Serbes*, Muaz Kemerli, Ahmet Aydin, Muhammed Necmeddin Sami Inanir, Tahsin Engin

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Özet

In this study, the effect of viscous damping coefficient of the liquid in Tuned Liquid Column Damper (TLCD) & structural systems under harmonic excitation was numerically investigated. The system under consideration is a TLCD-equipped structural system being manufactured for research purposes at Sakarya University's SARGEM research center for shaking tests. The parameters of this system were used as a reference in the numerical solution of the mathematical model using the 4th-order Runge-Kutta method, and the accuracy of the solution was verified with the MATLAB - SIMULINK toolbox. Subsequently, structural damping was addressed through dimensionless parameters commonly used in the study of TLCD-equipped structural systems: mass ratio, length ratio, and dimensionless excitation frequency. Two other dimensionless parameters related to displacement were derived as an evaluation criteria. The variation on these two parameters depending on the TLCD design was examined using the numerical solution code. The optimum design conditions of the TLCD are evaluated for an effective damping.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıISAS 2023 - 7th International Symposium on Innovative Approaches in Smart Technologies, Proceedings
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
ISBN (Elektronik)9798350383065
DOI'lar
Yayın durumuYayınlandı - 2023
Etkinlik7th International Symposium on Innovative Approaches in Smart Technologies, ISAS 2023 - Istanbul, Turkey
Süre: 23 Kas 202325 Kas 2023

Yayın serisi

AdıISAS 2023 - 7th International Symposium on Innovative Approaches in Smart Technologies, Proceedings

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???event.eventtypes.event.conference???7th International Symposium on Innovative Approaches in Smart Technologies, ISAS 2023
Ülke/BölgeTurkey
ŞehirIstanbul
Periyot23/11/2325/11/23

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© 2023 IEEE.

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