Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi

Semih Doǧu

doi:10.1109/SIU59756.2023.10223767

Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi

Semih Doǧu^*

^*Bu çalışma için yazışmadan sorumlu yazar

Elektronik ve Hab.Müh.Bölümü

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde Bölüm › Konferans katkısı › bilirkişi

1 Atıf (Scopus)

Özet

The through-the-wall imaging problem can be solved using microwave measurement systems. It is clear that the through-the-wall imaging topic is a significant issue when considering security and search/rescue activities. Due to the wall being an electromagnetically powerful scatterer, the detection of the objects behind the wall has some difficulties. High-scatter objects can be easily detected, but in some cases, low-scatter objects cannot be detected because of the decrease in signal levels. In this study, it is demonstrated with realistic simulations that it is possible to detect using the factorization method by changing the radius and dielectric permittivity of the low-scatter object placed behind the wall.

Tercüme edilen katkı başlığı	Investigation of Detectabilities of the Dielectric Objects in a Through-the-Wall Microwave Imaging Setup
Orijinal dil	Türkçe
Ana bilgisayar yayını başlığı	31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023
Yayınlayan	Institute of Electrical and Electronics Engineers Inc.
ISBN (Elektronik)	9798350343557
DOI'lar	https://doi.org/10.1109/SIU59756.2023.10223767
Yayın durumu	Yayınlandı - 2023
Etkinlik	31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023 - Istanbul, Türkiye Süre: 5 Tem 2023 → 8 Tem 2023

Yayın serisi

Adı	31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023
Ülke/Bölge	Türkiye
Şehir	Istanbul
Periyot	5/07/23 → 8/07/23

Bibliyografik not

Publisher Copyright:
© 2023 IEEE.

Keywords

factorization method
microwave measurement systems
through-the-wall imaging

Belgeye Erişim

10.1109/SIU59756.2023.10223767

Diğer Dosyalar ve Linkler

Link to publication in Scopus

Alıntı Yap

Doǧu, S. (2023). Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi. In 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023 (31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SIU59756.2023.10223767

Doǧu, Semih. / Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi. 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023).

@inproceedings{c82a97a74813402ca218b5f4b4a6c556,

title = "Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga G{\"o}r{\"u}nt{\"u}leme Yapilandirmasinda Tespit Edilebilirliklerinin Ara{\c s}tirilmasi",

abstract = "The through-the-wall imaging problem can be solved using microwave measurement systems. It is clear that the through-the-wall imaging topic is a significant issue when considering security and search/rescue activities. Due to the wall being an electromagnetically powerful scatterer, the detection of the objects behind the wall has some difficulties. High-scatter objects can be easily detected, but in some cases, low-scatter objects cannot be detected because of the decrease in signal levels. In this study, it is demonstrated with realistic simulations that it is possible to detect using the factorization method by changing the radius and dielectric permittivity of the low-scatter object placed behind the wall.",

keywords = "factorization method, microwave measurement systems, through-the-wall imaging",

author = "Semih Doǧu",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023 ; Conference date: 05-07-2023 Through 08-07-2023",

year = "2023",

doi = "10.1109/SIU59756.2023.10223767",

language = "T{\"u}rk{\c c}e",

series = "31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023",

address = "United States",

}

Doǧu, S 2023, Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi. in 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023. 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023, Institute of Electrical and Electronics Engineers Inc., 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023, Istanbul, Türkiye, 5/07/23. https://doi.org/10.1109/SIU59756.2023.10223767

Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi. / Doǧu, Semih.
31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023).

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde Bölüm › Konferans katkısı › bilirkişi

TY - GEN

T1 - Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi

AU - Doǧu, Semih

PY - 2023

Y1 - 2023

N2 - The through-the-wall imaging problem can be solved using microwave measurement systems. It is clear that the through-the-wall imaging topic is a significant issue when considering security and search/rescue activities. Due to the wall being an electromagnetically powerful scatterer, the detection of the objects behind the wall has some difficulties. High-scatter objects can be easily detected, but in some cases, low-scatter objects cannot be detected because of the decrease in signal levels. In this study, it is demonstrated with realistic simulations that it is possible to detect using the factorization method by changing the radius and dielectric permittivity of the low-scatter object placed behind the wall.

AB - The through-the-wall imaging problem can be solved using microwave measurement systems. It is clear that the through-the-wall imaging topic is a significant issue when considering security and search/rescue activities. Due to the wall being an electromagnetically powerful scatterer, the detection of the objects behind the wall has some difficulties. High-scatter objects can be easily detected, but in some cases, low-scatter objects cannot be detected because of the decrease in signal levels. In this study, it is demonstrated with realistic simulations that it is possible to detect using the factorization method by changing the radius and dielectric permittivity of the low-scatter object placed behind the wall.

KW - factorization method

KW - microwave measurement systems

KW - through-the-wall imaging

UR - https://www.scopus.com/pages/publications/85173466263

U2 - 10.1109/SIU59756.2023.10223767

DO - 10.1109/SIU59756.2023.10223767

M3 - Konferans katkısı

AN - SCOPUS:85173466263

T3 - 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023

BT - 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023

Y2 - 5 July 2023 through 8 July 2023

ER -

Doǧu S. Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi. In 31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023). doi: 10.1109/SIU59756.2023.10223767

Dielektrik Objelerin Bir Duvar Arkasi Mikrodalga Görüntüleme Yapilandirmasinda Tespit Edilebilirliklerinin Araştirilmasi

Özet

Yayın serisi

???event.eventtypes.event.conference???

Bibliyografik not

Keywords

Belgeye Erişim

Diğer Dosyalar ve Linkler

Parmak izi

Alıntı Yap