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Development of an IT equipment lumped capacitance parameter database for transient data center simulations

  • Dustin W. Demetriou*
  • , Hamza Salih Erden
  • , H. Ezzat Khalifa
  • , Roger R. Schmidt
  • *Bu çalışma için yazışmadan sorumlu yazar
  • IBM
  • Syracuse University

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıbilirkişi

8 Atıf (Scopus)

Özet

The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server's time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that proposed methodology to introduce a possible approach for developing an easy-to-use database of lumped capacitance characteristics for use in transient thermal simulations. The database will allow the user to select the appropriate transient parameters based on characteristics that do not require an autopsy of each-and-every server in the data center. Experiments are conducted to provide representative transient parameters which classify the servers by mass density and operating air flow rate. The paper describes the experimental methodology in detail to allow for the easy addition of other IT equipment or future server generations.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
YayınlayanInstitute of Electrical and Electronics Engineers Inc.
Sayfalar1330-1337
Sayfa sayısı8
ISBN (Elektronik)9781479952670
DOI'lar
Yayın durumuYayınlandı - 4 Eyl 2014
Harici olarak yayınlandıEvet
Etkinlik14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States
Süre: 27 May 201430 May 2014

Yayın serisi

AdıThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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???event.eventtypes.event.conference???14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Ülke/BölgeUnited States
ŞehirOrlando
Periyot27/05/1430/05/14

Bibliyografik not

Publisher Copyright:
© 2014 IEEE.

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