Özet
In the telecommunication industry, the prediction of customer churn behavior is a subject of active research. Features derived from customers' use of telecom infrastructure are often used to predict customer churn behavior. However, the complex networks created by the communication data between the customers and the features to be obtained from these networks can also affect customer churn behavior. Within the scope of this research, features, which are used to predict customer churn behavior by using Social Network Analysis (SNA) techniques on complex networks formed as a result of customer interaction on telecom infrastructures, are proposed. In addition to that, a data analysis workflow method that can predict customer churn behavior is suggested. A prototype application of the proposed method was developed and its success in predicting customer churn behavior was evaluated with experimental studies. In this study, an anonymized data set belonging to a telecom industry firm is used. The results obtained show that the proposed method can make successful predictions and is usable.
| Orijinal dil | İngilizce |
|---|---|
| Ana bilgisayar yayını başlığı | 3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021 |
| Yayınlayan | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Elektronik) | 9781665438971 |
| DOI'lar | |
| Yayın durumu | Yayınlandı - 12 Haz 2021 |
| Harici olarak yayınlandı | Evet |
| Etkinlik | 3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021 - Kuala Lumpur, Malaysia Süre: 12 Haz 2021 → 13 Haz 2021 |
Yayın serisi
| Adı | 3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021 |
|---|
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| ???event.eventtypes.event.conference??? | 3rd International Conference on Electrical, Communication and Computer Engineering, ICECCE 2021 |
|---|---|
| Ülke/Bölge | Malaysia |
| Şehir | Kuala Lumpur |
| Periyot | 12/06/21 → 13/06/21 |
Bibliyografik not
Publisher Copyright:© 2021 IEEE.
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