Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex

Keyphrases

• Polystyrene 100%
• Cu(II) 100%
• Sulfonyl Hydrazides 100%
• Surface Binding 100%
• Hydrazine 66%
• Polystyrene Surface 66%
• Surface Activation 66%
• Room Temperature 33%
• Scanning Electron Microscopy 33%
• Contact Time 33%
• Pullout 33%
• Electroless Plating 33%
• X-ray Photoelectron Spectroscopy 33%
• Palladium 33%
• Plating Process 33%
• Modified Technique 33%
• Chlorosulfonic Acid 33%
• Analytical Procedures 33%
• Copper Plating 33%
• Copper Pattern 33%
• Electroless Copper 33%
• Electroless Metal Deposition 33%
• Copper Deposition 33%
• Chlorosulfonation 33%
• Deposition Methods 33%

Material Science

• Polystyrene 100%
• Plating 50%
• Scanning Electron Microscopy 25%
• Density 25%
• Palladium 25%
• Metal Deposition 25%