Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Junghyun Park; Ignace Agbadan; Monsuru Dauda; Mustapha Bello; John Hendershot; Soundarzo Tasnim; Omotolani Oduyebo; Sunggook Park; Anthony Engler; Jaimal Williamson; Varughese Mathew; Cigdem Atalay-Oral; John Flake

doi:10.1149/2162-8777/ae170a

Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Junghyun Park
, Ignace Agbadan
, Monsuru Dauda
, Mustapha Bello
, John Hendershot
, Soundarzo Tasnim
, Omotolani Oduyebo
, Sunggook Park
, Anthony Engler
, Jaimal Williamson
, Varughese Mathew
, Cigdem Atalay-Oral
, John Flake^*

^*Bu çalışma için yazışmadan sorumlu yazar

Louisiana State University
Louisiana State University
Texas Instruments
NXP Semiconductors

Araştırma çıktısı: Dergi yayını › Makale › Hakem

Özet

Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW_0.66P_0.17 interface enhances adhesion due to its stable oxides. The CoW_0.66P_0.17 shows stability with a 0.02 dB mm⁻¹ S21 change after 1500 cycles.

Orijinal dil	İngilizce
Makale numarası	111004
Dergi	ECS Journal of Solid State Science and Technology
Hacim	14
Basın numarası	11
DOI'lar	https://doi.org/10.1149/2162-8777/ae170a
Yayın durumu	Yayınlandı - 1 Kas 2025
Harici olarak yayınlandı	Evet

Bibliyografik not

Publisher Copyright:
© 2025 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited.

Belgeye Erişim

10.1149/2162-8777/ae170a

Diğer Dosyalar ve Linkler

Link to publication in Scopus

Alıntı Yap

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title = "Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects",

abstract = "Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.",

keywords = "Chip-to-chip (C2C) interconnect, cladding, coupling agent, metal interlayer, multichip package, oxidation, polymer-metal adhesion",

author = "Junghyun Park and Ignace Agbadan and Monsuru Dauda and Mustapha Bello and John Hendershot and Soundarzo Tasnim and Omotolani Oduyebo and Sunggook Park and Anthony Engler and Jaimal Williamson and Varughese Mathew and Cigdem Atalay-Oral and John Flake",

note = "Publisher Copyright: {\textcopyright} 2025 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited.",

year = "2025",

month = nov,

day = "1",

doi = "10.1149/2162-8777/ae170a",

language = "English",

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TY - JOUR

T1 - Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

AU - Park, Junghyun

AU - Agbadan, Ignace

AU - Dauda, Monsuru

AU - Bello, Mustapha

AU - Hendershot, John

AU - Tasnim, Soundarzo

AU - Oduyebo, Omotolani

AU - Park, Sunggook

AU - Engler, Anthony

AU - Williamson, Jaimal

AU - Mathew, Varughese

AU - Atalay-Oral, Cigdem

AU - Flake, John

PY - 2025/11/1

Y1 - 2025/11/1

N2 - Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.

AB - Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.

KW - Chip-to-chip (C2C) interconnect

KW - cladding

KW - coupling agent

KW - metal interlayer

KW - multichip package

KW - oxidation

KW - polymer-metal adhesion

UR - https://www.scopus.com/pages/publications/105033915869

U2 - 10.1149/2162-8777/ae170a

DO - 10.1149/2162-8777/ae170a

M3 - Article

AN - SCOPUS:105033915869

SN - 2162-8769

VL - 14

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 11

M1 - 111004

ER -

Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Özet

Bibliyografik not

Belgeye Erişim

Diğer Dosyalar ve Linkler

Parmak izi

Alıntı Yap