TY - GEN
T1 - Computer simulation of 3D complex material-based devices
AU - Prishvin, M.
AU - Tabatadze, V.
AU - Petoev, I.
AU - Kakulia, D.
AU - Zaridze, R.
PY - 2009
Y1 - 2009
N2 - Several aspects of computer-aided modeling and simulation of 3D complex material PBG devices are discussed. Software package for simulation, analysis, design and optimization of wide variety such devices has been created. Periodic structures of doped elements responsible for complex properties of integral objects are the basis of devices. It is proposed, that complex dielectric properties (ε, μ) of the main part, together with specially fitted doped elements create the rest admittances (α and β) of the meta-materials. The need of 3D numerical simulations and design are discussed. The Method of Auxiliary Sources (MAS) [1] is applied to simulate EM field distribution in microwave and THz frequency ranges.
AB - Several aspects of computer-aided modeling and simulation of 3D complex material PBG devices are discussed. Software package for simulation, analysis, design and optimization of wide variety such devices has been created. Periodic structures of doped elements responsible for complex properties of integral objects are the basis of devices. It is proposed, that complex dielectric properties (ε, μ) of the main part, together with specially fitted doped elements create the rest admittances (α and β) of the meta-materials. The need of 3D numerical simulations and design are discussed. The Method of Auxiliary Sources (MAS) [1] is applied to simulate EM field distribution in microwave and THz frequency ranges.
UR - http://www.scopus.com/inward/record.url?scp=70449353865&partnerID=8YFLogxK
U2 - 10.1109/EMCEUROPE.2009.5189705
DO - 10.1109/EMCEUROPE.2009.5189705
M3 - Conference contribution
AN - SCOPUS:70449353865
SN - 9781424441082
T3 - 2009 International Symposium on Electromagnetic Compatibility - EMC Europe
BT - 2009 International Symposium on Electromagnetic Compatibility - EMC Europe
T2 - 2009 International Symposium on Electromagnetic Compatibility - EMC Europe
Y2 - 11 June 2009 through 12 June 2009
ER -