Boiling heat transfer performance enhancement using micro and nano structured surfaces for high heat flux electronics cooling systems

Keyphrases

• Performance Enhancement 100%
• High Heat Flux 100%
• Heat Transfer Performance 100%
• Microstructured Surface 100%
• Boiling Heat Transfer 100%
• Electronic Cooling System 100%
• Nanostructured Surfaces 100%
• Surface Morphology 66%
• Surface Structure 66%
• Structured Surface 66%
• Nanoscale Structure 66%
• Microstructure 33%
• High Temperature 33%
• Working Fluid 33%
• Heat Transfer Coefficient 33%
• Mass Flux 33%
• Heat Transfer Characteristics 33%
• Nanostructures 33%
• Heat Transfer Mechanism 33%
• Nanosize 33%
• Thermal Image 33%
• Thermal Camera 33%
• Rectangular Microchannel 33%
• High-speed Camera 33%
• Distilled Water 33%
• Energy Efficiency Improvement 33%
• Surface Temperature Distribution 33%
• Micro-nano 33%
• Size Scaling 33%
• Micro-sized 33%
• Structure Size 33%
• Flow Map 33%
• Micro-nano Structure 33%
• Visualization Study 33%
• Heat Removal Rate 33%
• Copper Surface 33%
• Bubble Departure Frequency 33%
• Microscale Structure 33%
• Pool Boiling Enhancement 33%

Engineering

• Cooling System 100%
• Boiling Heat Transfer 100%
• Nanostructured Surface 100%
• Micro Structured Surface 100%
• Heat Flux 100%
• Microscale 66%
• Nanomaterial 66%
• Structured Surface 66%
• Surface Morphology 66%
• Energy Conservation 33%
• Energy Efficiency 33%
• Nanoscale 33%
• Heat Transfer Coefficient 33%
• Microchannel 33%
• Removal Rate 33%
• Rectangular Microchannel 33%
• Heat Removal 33%
• Structure Surface 33%
• Structure Size 33%
• Size Scale 33%
• Surface Temperature Distribution 33%
• Mass Transfer 33%
• Heat Transfer 33%