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Assessment of the energy performance of cogeneration systems for powering and cooling data centers

  • Dale C. Ringham
  • , Dan J. Rice
  • , Brian S. Granetz
  • , Hamza Salih Erden
  • , H. Ezzat Khalifa
  • , Roger R. Schmidt
  • Syracuse University
  • IBM

Araştırma çıktısı: Kitap/Rapor/Konferans Bildirisinde BölümKonferans katkısıHakem

Özet

The Syracuse/IBM Green Data Center utilizes micro turbines in combination with exhaust fired heat exchangers and absorption chillers to produce electrical power, cooling and heating for the data center and surrounding infrastructure. The overall efficiency of cogeneration systems depend greatly on the utilization of turbine exhaust heat. This makes a data center (where cooling load and electrical power requirements are closely correlated) an excellent candidate for cogeneration technology. Over 200 data points collected in the data center allow for in-depth energy analysis of this unique data center and the surrounding infrastructure. This paper provides information on the Syracuse/IBM Green Data Center systems as well as analysis of the data center over all four seasons. In addition to PUE, the common data center metric, a new metric defined as ERE1 is used to measure data center efficiency when energy is exported to the surrounding infrastructure.

Orijinal dilİngilizce
Ana bilgisayar yayını başlığıASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI'lar
Yayın durumuYayınlandı - 2013
Harici olarak yayınlandıEvet
EtkinlikASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Süre: 16 Tem 201318 Tem 2013

Yayın serisi

AdıASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Hacim2

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???event.eventtypes.event.conference???ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Ülke/BölgeUnited States
ŞehirBurlingame, CA
Periyot16/07/1318/07/13

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