An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Aziz Koyuncuoğlu; Göker Türkakar; Matthew Redmond; Tuba Okutucu-özyurt; Haluk Külah; Satish Kumar

doi:10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Aziz Koyuncuoğlu
, Göker Türkakar
, Matthew Redmond
, Tuba Okutucu-özyurt
, Haluk Külah
, Satish Kumar

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde Bölüm › Konferans katkısı › bilirkişi

Özet

A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm^2·K/W with a corresponding heat flux of 128.5 W/cm² and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

Orijinal dil	İngilizce
Ana bilgisayar yayını başlığı	Proceedings of CONV-14
Ana bilgisayar yayını alt yazısı	International Symposium on Convective Heat and Mass Transfer, 2014
Yayınlayan	Begell House Inc.
Sayfalar	941-952
Sayfa sayısı	12
ISBN (Basılı)	9781567003567
DOI'lar	https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700
Yayın durumu	Yayınlandı - 2014
Harici olarak yayınlandı	Evet
Etkinlik	International Symposium on Convective Heat and Mass Transfer, CONV 2014 - Kusadasi, Turkey Süre: 8 Haz 2014 → 13 Haz 2014

Yayın serisi

Adı	International Symposium on Advances in Computational Heat Transfer
ISSN (Basılı)	2578-5486

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	International Symposium on Convective Heat and Mass Transfer, CONV 2014
Ülke/Bölge	Turkey
Şehir	Kusadasi
Periyot	8/06/14 → 13/06/14

Bibliyografik not

Publisher Copyright:
© 2014, Begell House Inc. All rights reserved.

Finansman

This research has been financially supported by the Scientific and Technological Research Council of Turkey under grant number TÜBİTAK 108M515. The third author is a visiting researcher in Turkey on Fulbright scholarship. This research has been financially supported by the Scientific and Council of Turkey under grant number TÜBİTAK 108M515. The researcher in Turkey on Fulbrightscholarship.

Finansörler	Finansör numarası
Council of Turkey
Türkiye Bilimsel ve Teknolojik Araştirma Kurumu	TÜBİTAK 108M515

Belgeye Erişim

10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

Diğer Dosyalar ve Linkler

Link to publication in Scopus

Alıntı Yap

Koyuncuoğlu, A., Türkakar, G., Redmond, M., Okutucu-özyurt, T., Külah, H., & Kumar, S. (2014). An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. In Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014 (pp. 941-952). (International Symposium on Advances in Computational Heat Transfer). Begell House Inc.. https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

@inproceedings{047830efc5d94aae993867c8de67a0e2,

title = "An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks",

abstract = "A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.",

keywords = "CMOS compatible, Chip cooling, Figure of merit, thermal resistance minimization, Microchannel heat sink, Monolithic design",

author = "Aziz Koyuncuoğlu and G{\"o}ker T{\"u}rkakar and Matthew Redmond and Tuba Okutucu-{\"o}zyurt and Haluk K{\"u}lah and Satish Kumar",

note = "Publisher Copyright: {\textcopyright} 2014, Begell House Inc. All rights reserved.; International Symposium on Convective Heat and Mass Transfer, CONV 2014 ; Conference date: 08-06-2014 Through 13-06-2014",

year = "2014",

doi = "10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700",

language = "English",

isbn = "9781567003567",

series = "International Symposium on Advances in Computational Heat Transfer",

publisher = "Begell House Inc.",

pages = "941--952",

booktitle = "Proceedings of CONV-14",

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}

Koyuncuoğlu, A, Türkakar, G, Redmond, M, Okutucu-özyurt, T, Külah, H & Kumar, S 2014, An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. in Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. International Symposium on Advances in Computational Heat Transfer, Begell House Inc., pp. 941-952, International Symposium on Convective Heat and Mass Transfer, CONV 2014, Kusadasi, Turkey, 8/06/14. https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. / Koyuncuoğlu, Aziz; Türkakar, Göker; Redmond, Matthew et al.
Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. Begell House Inc., 2014. p. 941-952 (International Symposium on Advances in Computational Heat Transfer).

Araştırma sonucu: Kitap/Rapor/Konferans Bildirisinde Bölüm › Konferans katkısı › bilirkişi

TY - GEN

T1 - An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

AU - Koyuncuoğlu, Aziz

AU - Türkakar, Göker

AU - Redmond, Matthew

AU - Okutucu-özyurt, Tuba

AU - Külah, Haluk

AU - Kumar, Satish

PY - 2014

Y1 - 2014

N2 - A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

AB - A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

KW - CMOS compatible

KW - Chip cooling

KW - Figure of merit, thermal resistance minimization

KW - Microchannel heat sink

KW - Monolithic design

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DO - 10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

M3 - Conference contribution

AN - SCOPUS:85120885677

SN - 9781567003567

T3 - International Symposium on Advances in Computational Heat Transfer

SP - 941

EP - 952

BT - Proceedings of CONV-14

PB - Begell House Inc.

T2 - International Symposium on Convective Heat and Mass Transfer, CONV 2014

Y2 - 8 June 2014 through 13 June 2014

ER -

Koyuncuoğlu A, Türkakar G, Redmond M, Okutucu-özyurt T, Külah H, Kumar S. An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. In Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. Begell House Inc. 2014. p. 941-952. (International Symposium on Advances in Computational Heat Transfer). doi: 10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Özet

Yayın serisi

???event.eventtypes.event.conference???

Bibliyografik not

Finansman

Belgeye Erişim

Diğer Dosyalar ve Linkler

Parmak izi

Alıntı Yap