A New Design of Epoxy Based Composites Reinforced With Devulcanized Rubber, Alumina Fiber and BN

In last decades, microelectronic and aerospace industries are in the search of multi-functional high performance, light weight and low-cost materials. The miniaturization of electronic devices requires up-to-date precautions in insulating materials and packaging. In addition, in aerospace industry, some of the components expose to high tribological loads. From these issues, the main tasks are thought as designing new materials with low dielectric constant, high tribological resistivity and high thermal conductivity. Also, ease of manufacturing and good mechanical properties play a key role to choose the type of the material to be used. In this regard, polymers are thought a good option to manufacture components for micro electric applications. However, raw polymers cannot meet the requirements mentioned above. For this reason, they should be modified with certain fillers. In this study, fresh scrap recycled rubber modified epoxy based composite was reinforced with boron nitride (BN) and alumina fibers (Al2O3) and silicon carbide (SiC). The mechanical and physical properties of these composite systems are studied. Physical properties such as glass transition temperature and phase transitions are determined with dynamical mechanical analysis (DMA) and differential scanning calorimeter (DSC). Mechanical properties are evaluated by means of three-point bending tests and nano indentation. Also, tribological characterization is done by means of scratch tests and nano indenter. After these tests, scanning electron microscope (SEM) is used to observe the microstructure and fracture surfaces to identify failure mechanisms.