3D Printable BN/PEEK/PEI Polymer Blend Composites for Thermal Management Applications

Demands for thermal management applications indicate the necessity to produce complex shapes with thermally conductive materials. Through advancements in the electronics industry and the emergence of new applications, there is a growing need for the development of innovative polymer-based materials combined with cutting-edge manufacturing technologies such as 3D printing. In this study, PEEK/PEI polymer blends were fabricated through melt-processing, and the compatibility of these blends was thoroughly examined to formulate an optimized composition in filaments for 3D printing. The findings indicated that the blending of PEEK and PEI matrices resulted in a reduction in viscosity, thereby enhancing their processability and printability after reinforcing. Mechanical properties were explored and showcased good compatibility between PEEK and PEI matrices without compromising tensile strength, particularly in PEEK/PEI compositions with an 80/20 ratio. Furthermore, thermally conductive PEEK/PEI blends were developed by incorporating h-BN, and the printability and thermal conductivity behaviors of the resulting 20 wt.% BN-incorporated PEEK/PEI blend composites were studied for two different PEEK/PEI ratios. The materials developed here serve as a promising feedstock for 3D printing, enabling the development of multifunctional prototypes tailored for thermal management applications.