TY - GEN
T1 - Wafer test probe burn modeling and characterization
AU - Zafer, Baha
AU - Vishkasougheh, Mehdi H.
AU - Tunaboylu, Bahadir
PY - 2013
Y1 - 2013
N2 - This study investigates the wafer probe temperature distribution along a probe body in order to model probe burn phenomenon by using computational mechanics techniques. The finite volume software is used to study the effects of different materials and different geometrical factors on the temperature along a special design vertical/spring and cantilever probe. The computation shows higher temperatures towards the probe tip region as a result of Joule heating. The probe burn is also observed at the tip region of spring and cantilever probes in wafer testing. This is believed to be due to very low heat dissipation rates resulting from very small sizes compared to the probe body.
AB - This study investigates the wafer probe temperature distribution along a probe body in order to model probe burn phenomenon by using computational mechanics techniques. The finite volume software is used to study the effects of different materials and different geometrical factors on the temperature along a special design vertical/spring and cantilever probe. The computation shows higher temperatures towards the probe tip region as a result of Joule heating. The probe burn is also observed at the tip region of spring and cantilever probes in wafer testing. This is believed to be due to very low heat dissipation rates resulting from very small sizes compared to the probe body.
UR - http://www.scopus.com/inward/record.url?scp=84880977421&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2013.6529912
DO - 10.1109/EuroSimE.2013.6529912
M3 - Conference contribution
AN - SCOPUS:84880977421
SN - 9781467361385
T3 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Y2 - 14 April 2013 through 17 April 2013
ER -