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Translated title of the contribution: Machine Learning-based Crop Yield Prediction by Data Augmentation

Alper Balmumcu, Koray Kayabol, Esra Erten

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

In this study, the effects of dynamic climate and biophysical parameters and static soil parameters obtained from earth observation satellites on cotton yield estimation were examined with four different machine learning algorithms; multilayer perceptrons, long short term memory, quantile regression and extreme gradient boosting (XGBoost). According to the feature space created from climate (temperature, precipitation, etc.), biophysical (leaf area index, vegetation index, etc.) and soil (sand ratio, water permeability, etc.) parameters, the XGBoost approach predicted cotton yield with the highest accuracy. By applying Shapley Additive Global Importance and SHAP to this model, the driving factors of cotton yield prediction were analyzed. As a result of these analyses, the model explains 32% static, that is, soil parameters, and 68% dynamic parameters. The most important dynamic and static parameters were determined as surface soil moisture and clay.

Translated title of the contributionMachine Learning-based Crop Yield Prediction by Data Augmentation
Original languageTurkish
Title of host publication32nd IEEE Conference on Signal Processing and Communications Applications, SIU 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350388961
DOIs
Publication statusPublished - 2024
Event32nd IEEE Conference on Signal Processing and Communications Applications, SIU 2024 - Mersin, Turkey
Duration: 15 May 202418 May 2024

Publication series

Name32nd IEEE Conference on Signal Processing and Communications Applications, SIU 2024 - Proceedings

Conference

Conference32nd IEEE Conference on Signal Processing and Communications Applications, SIU 2024
Country/TerritoryTurkey
CityMersin
Period15/05/2418/05/24

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

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