Transient thermal response of servers through air temperature measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

14 Citations (Scopus)

Abstract

Transient CFD analysis of data centers requires appropriate representations of the transient thermal characteristics of servers. Thermal conductance and thermal capacitance are two determining characteristics for the response of servers under unsteady conditions. Previous studies proposed tests that require detailed temperature and thermal capacitance measurements for each of the server component, requiring access to individual components inside the server. In this paper, we propose a method for obtaining the transient thermal characteristics of a server from server inlet and outlet temperatures under transient operating conditions.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
Publication statusPublished - 2013
Externally publishedYes
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: 16 Jul 201318 Jul 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume2

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period16/07/1318/07/13

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