Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities

Ali Dogan, Hüseyin Arslan*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Because of the increasing complexity and cost of experiments carried out, the data for the multi-component alloy systems have frequently been obtained by numerical modelling. It is clear that the related calculations require reliable data dealing with the pure components and binary alloy systems. Selecting the reliable data concerning the pure components from the literature, the viscosities for the SAC and (SAC)1− x Cox solder alloys have been calculated using different viscosity models (geometric and physical). The viscosity decreases as the amount of tin content increases in the SAC387 alloy while the addition of the cobalt to SAC387 solder results in the increasing of the viscosity. Moreover, by computing the root mean square values between theoretical and experimental viscosities, it can be concluded that the lowest value among all models is that of obtained by Kaptay equation.

Original languageEnglish
Pages (from-to)267-283
Number of pages17
JournalPhilosophical Magazine
Volume99
Issue number3
DOIs
Publication statusPublished - 1 Feb 2019
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2018, © 2018 Informa UK Limited, trading as Taylor & Francis Group.

Keywords

  • Dynamic viscosity
  • geometric models
  • multi-component alloys
  • pb-free ternary SAC and Quaternary (SAC) co solder alloys
  • physical models

Fingerprint

Dive into the research topics of 'Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities'. Together they form a unique fingerprint.

Cite this