The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

Semih Dogu; Hadi Alidoustaghdam; Ismail Dilman; Mehmet Nuri Akinci

doi:10.1109/MTTW51045.2020.9244925

The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

Semih Dogu, Hadi Alidoustaghdam, Ismail Dilman, Mehmet Nuri Akinci

Department of Electronics and Communication Engineering

Istanbul Technical University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Citations (Scopus)

Abstract

In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.

Original language	English
Title of host publication	Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
Editors	Arturs Aboltins, Anna Litvinenko
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	76-81
Number of pages	6
ISBN (Electronic)	9781728193984
DOIs	https://doi.org/10.1109/MTTW51045.2020.9244925
Publication status	Published - 1 Oct 2020
Event	2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020 - Virtual, Riga, Latvia Duration: 1 Oct 2020 → 2 Oct 2020

Publication series

Name	Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020

Conference

Conference	2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
Country/Territory	Latvia
City	Virtual, Riga
Period	1/10/20 → 2/10/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

Through the wall imaging
inverse scattering theory.
truncated singular value decomposition

Access to Document

10.1109/MTTW51045.2020.9244925

Cite this

Dogu, S., Alidoustaghdam, H., Dilman, I., & Akinci, M. N. (2020). The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging. In A. Aboltins, & A. Litvinenko (Eds.), Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020 (pp. 76-81). Article 9244925 (Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MTTW51045.2020.9244925

Dogu, Semih ; Alidoustaghdam, Hadi ; Dilman, Ismail et al. / The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging. Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020. editor / Arturs Aboltins ; Anna Litvinenko. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 76-81 (Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020).

@inproceedings{410560a77d0741a78c9b9dba99b1a6f4,

title = "The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging",

abstract = "In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.",

keywords = "Through the wall imaging, inverse scattering theory., truncated singular value decomposition",

author = "Semih Dogu and Hadi Alidoustaghdam and Ismail Dilman and Akinci, {Mehmet Nuri}",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020 ; Conference date: 01-10-2020 Through 02-10-2020",

year = "2020",

month = oct,

day = "1",

doi = "10.1109/MTTW51045.2020.9244925",

language = "English",

series = "Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "76--81",

editor = "Arturs Aboltins and Anna Litvinenko",

booktitle = "Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020",

address = "United States",

}

Dogu, S, Alidoustaghdam, H, Dilman, I & Akinci, MN 2020, The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging. in A Aboltins & A Litvinenko (eds), Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020., 9244925, Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020, Institute of Electrical and Electronics Engineers Inc., pp. 76-81, 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020, Virtual, Riga, Latvia, 1/10/20. https://doi.org/10.1109/MTTW51045.2020.9244925

The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging. / Dogu, Semih; Alidoustaghdam, Hadi; Dilman, Ismail et al.
Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020. ed. / Arturs Aboltins; Anna Litvinenko. Institute of Electrical and Electronics Engineers Inc., 2020. p. 76-81 9244925 (Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

AU - Dogu, Semih

AU - Alidoustaghdam, Hadi

AU - Dilman, Ismail

AU - Akinci, Mehmet Nuri

PY - 2020/10/1

Y1 - 2020/10/1

N2 - In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.

AB - In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.

KW - Through the wall imaging

KW - inverse scattering theory.

KW - truncated singular value decomposition

UR - http://www.scopus.com/inward/record.url?scp=85096742995&partnerID=8YFLogxK

U2 - 10.1109/MTTW51045.2020.9244925

DO - 10.1109/MTTW51045.2020.9244925

M3 - Conference contribution

AN - SCOPUS:85096742995

T3 - Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020

SP - 76

EP - 81

BT - Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020

A2 - Aboltins, Arturs

A2 - Litvinenko, Anna

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020

Y2 - 1 October 2020 through 2 October 2020

ER -

Dogu S, Alidoustaghdam H, Dilman I, Akinci MN. The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging. In Aboltins A, Litvinenko A, editors, Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 76-81. 9244925. (Proceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020). doi: 10.1109/MTTW51045.2020.9244925

The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

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