Signal transfer via smart conductive networks for high temperature performing wearable electronics

Ercan Karabulut, Senem Kurşun Bahadır*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conductive networks were formed between the layers of high temperature-resistant fabric substrates which of the following substrates most likely consist of reactively sputtered aluminum particles, polybenzimidazoles (PBI), aramid, and glass fibers. The specimens were constructed using welding and conventional sewing techniques and their operating characteristics in terms of high temperature resistance (limited flame spread, convective heat transfer, radiant heat) and electrical properties (conductivity and signal quality in data transfer) were determined. As a result of thermal tests, the excellent performances among conductive networks are attributed to steel and copper threads used as signal transmission line hidden in the interface among aluminum, 100 % aramid (nonwoven), and epoxy layer used as a substrate. The efficient exploitation of smart conductive networks will boost the viability of data transfer quality among wearable electronic components performing at high temperatures.

Original languageEnglish
Pages (from-to)15996-16007
Number of pages12
JournalJournal of Materials Science: Materials in Electronics
Volume31
Issue number18
DOIs
Publication statusPublished - 1 Sept 2020

Bibliographical note

Publisher Copyright:
© 2020, Springer Science+Business Media, LLC, part of Springer Nature.

Funding

This research work was supported by the Istanbul Technical University, BAP, grant number MYL2018-41093. Authors also would like to thank Kıvanç Group in Turkey for supplying materials and testing.

FundersFunder number
British Association for PsychopharmacologyMYL2018-41093
Istanbul Teknik ÜniversitesiBAP-MYL2018-41093

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