TY - GEN
T1 - Room-level transient CFD modeling of rack shutdown
AU - Erden, Hamza Salih
AU - Ezzat Khalifa, H.
AU - Schmidt, Roger R.
PY - 2013
Y1 - 2013
N2 - Servers have time constants on the order of several minutes, which is significantly longer than many other time constants observed in data centers. When server thermal masses are not negligible, transient scenarios cannot be modeled appropriately with the steady state boundary conditions. By using the time constant and thermal masses of the servers, transient server air exit temperature can be calculated by solving unsteady heat balance equations for the server and air stream. This paper presents a room-level CFD case study of rack shutdown in which transient server exit air temperature are introduced via user defined functions. The results include verification of simulation results with the experimental data taken in a 3-rack test cell.
AB - Servers have time constants on the order of several minutes, which is significantly longer than many other time constants observed in data centers. When server thermal masses are not negligible, transient scenarios cannot be modeled appropriately with the steady state boundary conditions. By using the time constant and thermal masses of the servers, transient server air exit temperature can be calculated by solving unsteady heat balance equations for the server and air stream. This paper presents a room-level CFD case study of rack shutdown in which transient server exit air temperature are introduced via user defined functions. The results include verification of simulation results with the experimental data taken in a 3-rack test cell.
UR - http://www.scopus.com/inward/record.url?scp=84894659976&partnerID=8YFLogxK
U2 - 10.1115/IPACK2013-73282
DO - 10.1115/IPACK2013-73282
M3 - Conference contribution
AN - SCOPUS:84894659976
SN - 9780791855768
T3 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
T2 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Y2 - 16 July 2013 through 18 July 2013
ER -