Rapid Heating and Cooling Chamber for a Photonics Junction Measurement System

Gokberk Tarcin, Alper Saygin, Mete Muslu, Mete Budakli, Mehmet Arik

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Since many industrial applications require heat treatment processes or validation tests under certain ambient temperatures, thermal design is a key issue to be considered in order to ensure fast heating and cooling capabilities. Although most industrial furnaces provide the required isothermal conditions for various test applications or calibrations, a number of them does not provide rapid heating and cooling inside a closed system and the thermal equilibrium over different regions of the system are not satisfied as intended. This brings a number of challenges for the performance test of most electronics, which are affected by ambient temperatures, such as LEDs, lasers and transistors. Particularly, a test environment that can quickly and accurately adjust a uniformly distributed isothermal domain can be useful for many electronic components in order to test their performance at preselected ambient temperatures. In such systems, the design parameters have to be adjusted depending on the desired conditions. In fact, the design of those systems has to be planned in detail to achieve a system working fast and accurate, which shall contribute to reduction in operating time. Therefore, this study focuses on proposing a new approach to the development of a high-performance and high-resolution heating and cooling chamber used in a junction temperature measurement of light emitting diodes (LEDs). The major objective thereby is to achieve high heating and cooling rates of a controlled chamber that satisfies thermal conditions at a user defined temperature interval between 20°C and 80°C. Therefore, material properties and geometrical dimensions, power requirements and cooling performances of the chamber are analyzed as major design parameters. Numerical models are created for various design options, and simulations are performed for various working conditions under certain design constraints. The relationships between design parameters are determined. A final design is proposed that is able to reduce measurement time of photonic components at a temperature uniformity of less than + 0.5 °C.

Original languageEnglish
Title of host publicationProceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
PublisherIEEE Computer Society
Pages267-275
Number of pages9
ISBN (Electronic)9781728197647
DOIs
Publication statusPublished - Jul 2020
Externally publishedYes
Event19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
Duration: 21 Jul 202023 Jul 2020

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2020-July
ISSN (Print)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
Country/TerritoryUnited States
CityVirtual, Orlando
Period21/07/2023/07/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

  • Forward voltage method
  • Junction temperature measurement
  • Light Emitting Diodes
  • Photonics
  • Thermal design

Fingerprint

Dive into the research topics of 'Rapid Heating and Cooling Chamber for a Photonics Junction Measurement System'. Together they form a unique fingerprint.

Cite this