Abstract
This study presents an experimental investigation on the nucleate boiling heat transfer (NBHT) in deionized (DI) water and HFE-7100 on bare copper surfaces. The experiments were performed under atmospheric condition at 0 and 10 K subcooling levels. The primary objective was to understand the effect of fluid property on critical heat flux (CHF) and heat transfer performance, where the occurrence of surface oxidation over the entire set of experiments were investigated for a range of operating conditions. In order to determine the onset and development of the latter phenomenon, experiments for the complete boiling process have been repeated three times under similar conditions. A detailed visualization study with a highspeed camera has been utilized to capture the dynamics of bubble formation and departure. Additionally, high-resolution microscopic images were captured, and contact angle measurements were used to express the experimental results conveniently. Microscopic images showed that using DI water leads to an intensified oxidization on the heater surface, while HFE-7100 yields a minor occurrence of oxide layer on the copper surfaces. The results indicated that CHF values remain constant for water at 0 K; however, a remarkable increase was observed for 10 K subcooling from the first to third run of successive measurements.
Original language | English |
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Title of host publication | Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 |
Publisher | American Society of Mechanical Engineers (ASME) |
ISBN (Electronic) | 9780791886557 |
DOIs | |
Publication status | Published - 2022 |
Externally published | Yes |
Event | ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 - Garden Grove, United States Duration: 25 Oct 2022 → 27 Oct 2022 |
Publication series
Name | Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 |
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Conference
Conference | ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 |
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Country/Territory | United States |
City | Garden Grove |
Period | 25/10/22 → 27/10/22 |
Bibliographical note
Publisher Copyright:Copyright © 2022 by ASME.
Keywords
- critical heat flux
- dielectric liquids
- Heat transfer
- pool boiling
- surface oxidation