Parmak Izlerinde Hiperspektral Görüntüleme ile Üçüncü Seviye Kimliklendirme

Translated title of the contribution: Third Level Identification with Hyperspectral Imaging in Fingerprints

Vedat Delican, Behçet Uǧur Töreyin, Ege Çetin, Aylin Yalçin Saribey

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Fingerprints are accepted as the key evidence in reaching the crime and the criminal. Identification from fingerprints is done at three levels. At the first level; fingerprint groups and subgroups, at the second level; fingerprint line characteristics, and at the third level, details such as pores, papilla structure, width, mold area and fractures. With the developing technology, algorithms are developed in which fingerprint direction and angle, combinations of placement between papillary characteristics and papillary flows are included in the evaluation process. In the study, 1-n queries were made in a dataset created from 800 fingerprints by manually and automatically extracted features with the blob detection algorithm, by randomly generating the latent fingerprints on which the pore details were displayed on the fingerprint line characteristics with hyperspectral imaging. In the fingerprint query, the latent fingerprints and the plain tenprints in the dataset were ranked using a score-based approach using the iterative closest point algorithm. According to the results obtained, it was observed that the score of the first candidate was higher and the scores of the candidates who came after it, were lower with the increase in the number of pores marked on the papilla lines and the accurate marking of these pores.

Translated title of the contributionThird Level Identification with Hyperspectral Imaging in Fingerprints
Original languageTurkish
Title of host publication31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350343557
DOIs
Publication statusPublished - 2023
Event31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023 - Istanbul, Turkey
Duration: 5 Jul 20238 Jul 2023

Publication series

Name31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023

Conference

Conference31st IEEE Conference on Signal Processing and Communications Applications, SIU 2023
Country/TerritoryTurkey
CityIstanbul
Period5/07/238/07/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

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