Oxidized cornstarch – Urea wood adhesive for interior particleboard production

Salise Oktay, Nilgün Kızılcan*, Basak Bengu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

28 Citations (Scopus)

Abstract

Herein, a green binder formulation which contains oxidized corn starch (OCS) and urea (U) was developed for wood-based panel production. The obtained adhesive structure was strengthened by using titanium dioxide nanoparticle (nano-TiO2). Solid content and viscosity of the synthesized adhesives were determined. Chemical, crystalline structure and morphological properties of the synthesized adhesives, native and oxidized corn starch were investigated. Moreover, laboratory scale particleboards were produced by using a hybrid adhesive system. Mechanical tests of the boards were performed to examine the quality of OCS – U based adhesive and the obtained results evaluated in dry medium (P2) according to European norms EN 312 (2010). Formaldehyde content of the boards were measured by using the perforator method. The results showed that developed OCS – U based adhesive can be used with traditional melamine urea formaldehyde resin (MUF) as a hybrid adhesive system for producing particleboards with low formaldehyde content.

Original languageEnglish
Article number102947
JournalInternational Journal of Adhesion and Adhesives
Volume110
DOIs
Publication statusPublished - Oct 2021

Bibliographical note

Publisher Copyright:
© 2021

Funding

The authors would like to thank the Scientific and Technical Research Council of Turkey (TUBITAK) 2244 Industrial PhD Program -Istanbul Technical University-Kastamonu Entegre Ağaç San. Tic. A. Ş. Project No: 118C107.

FundersFunder number
Istanbul Technical University-Kastamonu Entegre Ağaç San118C107
Türkiye Bilimsel ve Teknolojik Araştirma Kurumu

    Keywords

    • Adhesives for wood
    • Low formaldehyde-content
    • Wood and wood composites

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