Abstract
Material characterization of 3D printed PLA parts with different infill rates was performed by standard tensile tests. Three-dimensional finite element simulations of the tensile tests were also performed. For the simulations, a method for reconstructing the CAD model of the printed parts with different infill rates was proposed and numerical simulations were conducted on the reconstructed models. A reasonable prediction of the experiments in terms of material behavior and the stress-strain characteristics for infill rate of 100% is obtained from the numerical analysis. Discrepancies between the numerical predictions and experimental results especially in the plastic deformation region for other infill rates are discussed in the paper.
| Original language | English |
|---|---|
| Title of host publication | 75th Annual Technical Conference and Exhibition of the Society of Plastics Engineers, SPE ANTEC Anaheim 2017 |
| Publisher | Society of Plastics Engineers |
| Pages | 75-81 |
| Number of pages | 7 |
| ISBN (Electronic) | 9780878493609 |
| ISBN (Print) | 978-0-692-88309-9 |
| Publication status | Published - 2017 |
| Event | 75th Annual Technical Conference and Exhibition of the Society of Plastics Engineers, SPE ANTEC Anaheim 2017 - Anaheim, United States Duration: 8 May 2017 → 10 May 2017 |
Publication series
| Name | Annual Technical Conference - ANTEC, Conference Proceedings |
|---|---|
| Volume | 2017-May |
Conference
| Conference | 75th Annual Technical Conference and Exhibition of the Society of Plastics Engineers, SPE ANTEC Anaheim 2017 |
|---|---|
| Country/Territory | United States |
| City | Anaheim |
| Period | 8/05/17 → 10/05/17 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
-
SDG 9 Industry, Innovation, and Infrastructure
Fingerprint
Dive into the research topics of 'Numerical and experimental analysis of infill rate on the mechanical properties of fused deposition modelling polylactic acid parts'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver