Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Thamer Khalif Salem; Ferina Saati Khosroshahi; Mehmet Arık; Mohammad O. Hamdan; Mete Budakli

doi:10.1080/08916152.2017.1397818

Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Thamer Khalif Salem^*, Ferina Saati Khosroshahi, Mehmet Arık, Mohammad O. Hamdan, Mete Budakli

^*Corresponding author for this work

Research output: Contribution to journal › Review article › peer-review

12 Citations (Scopus)

Abstract

Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in R_total compared with conventional heat pipe. Accordingly, reduction of R_total approximately 50% is achieved for both embedded PCB prototypes.

Original language	English
Pages (from-to)	1-13
Number of pages	13
Journal	Experimental Heat Transfer
Volume	32
Issue number	1
DOIs	https://doi.org/10.1080/08916152.2017.1397818
Publication status	Published - 2 Jan 2019
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2017, © 2017 Taylor & Francis.

Keywords

electronics cooling
embedded heat pipe
Heat pipe
printed circuit board
thermal conductivity

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10.1080/08916152.2017.1397818

Cite this

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title = "Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications",

abstract = "Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.",

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AU - Salem, Thamer Khalif

AU - Khosroshahi, Ferina Saati

AU - Arık, Mehmet

AU - Hamdan, Mohammad O.

AU - Budakli, Mete

PY - 2019/1/2

Y1 - 2019/1/2

N2 - Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.

AB - Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.

KW - electronics cooling

KW - embedded heat pipe

KW - Heat pipe

KW - printed circuit board

KW - thermal conductivity

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DO - 10.1080/08916152.2017.1397818

M3 - Review article

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JO - Experimental Heat Transfer

JF - Experimental Heat Transfer

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Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Abstract

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Keywords

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