Non-Ionic Photo-Acid Generators for Next-Generation EUV Photoresists

  • Madan R. Biradar
  • , Kyung Hee Oh
  • , Chung Hyeon Ban
  • , Jae Hyun Kim
  • , Rachel Snyder
  • , Ming Qi Li
  • , Kenneth Hernandez
  • , Huseyin Cem Kiliclar
  • , Gokhan Sagdic
  • , Christopher K. Ober

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Current leading photoresists depend on ionic photo-acid generators (PAGs) to provide strong acids that enable fast and robust deprotection chemistry. However, these ionic species are often poorly miscible with the hydrophobic organic polymers used in conventional photoresists, resulting in PAG inhomogeneity within the resist film. Non-ionic PAGs have shown improved miscibility and offer an alternative approach, resulting in lower defectivity and improved photosensitivity. Our program is focused on the design and synthesis of a series of non-ionic PAGs for EUV and DUV lithography. By modifying the PAG substitution, we demonstrate that we can tune both the pKa and photoactivity of the labile bond in the PAG, resulting in improved performance. Lastly, we evaluate the performance of the non-ionic PAG designs in both conventional acid deprotection-based photoresist polymers and next-generation photoresists based on an unzipping-type mechanism. Notably, the next-generation photoresists demonstrate faster photospeed in the presence of the non-ionic PAGs-despite their relatively low pKa as compared to currently leading ionic PAGs.

Original languageEnglish
Title of host publicationAdvances in Patterning Materials and Processes XLII
EditorsRyan Callahan, Anuja De Silva
PublisherSPIE
ISBN (Electronic)9781510686427
DOIs
Publication statusPublished - 2025
Externally publishedYes
EventAdvances in Patterning Materials and Processes XLII - San Jose, United States
Duration: 24 Feb 202527 Feb 2025

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume13428
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceAdvances in Patterning Materials and Processes XLII
Country/TerritoryUnited States
CitySan Jose
Period24/02/2527/02/25

Bibliographical note

Publisher Copyright:
© 2025 SPIE.

Keywords

  • DUV
  • EUV
  • Non-ionic PAG
  • Photoresist
  • Unzipping resist

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