Investigation of warpage behavior of single crystal silicon on a silicon - Adhesive - ceramic integrated structure at cryogenic temperatures

Keyphrases

• Multicrystalline Silicon 100%
• Cryogenic Temperature 100%
• Warpage 100%
• Silicon Material 50%
• Room Temperature 33%
• FEM Analysis 33%
• Silicon Semiconductor 33%
• Adhesive Layer 16%
• Thermal Stress 16%
• Semiconductor Materials 16%
• Infrared Sensor 16%
• Sensor Applications 16%
• Ceramic Layer 16%
• Material Thickness 16%
• Thermal Warpage 16%
• Heterogeneous Components 16%
• FEM Calculation 16%
• Trimaterial 16%
• Component Assembly 16%
• Parametric FEM 16%

Material Science

• Silicon Material 100%
• Single Crystal 100%
• Semiconductor Material 33%
• Thermal Stress 33%