Investigation of Grooved Heat Pipe Embedded Cold Plate Design with Additive Manufacturing

Vedat Yagci, Murat Parlak, Sertac Cadirci

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

Heat pipes that offer passive thermal management are frequently used for reliability. They can be used to carry heat through, as well as to increase the thermal conductivity of the base material. In the traditional method, externally produced heat pipes are embedded in another material with intermediate processes. Thanks to the advances in Additive Manufacturing (AM) Technology, it has become possible to produce products with a high thermal performance by producing cold plates with heat pipes inside. In this study, a heat pipe embedded cold plate used to cool an electronic card designed for military application was investigated. As the cold plate design target, the aim is to have aluminum's weight and copper's thermal performance. Weight affected thermal performance criteria are defined to compare the cold plates. In order to evaluate the thermal performance of the product during the design phase, thermal analysis was performed for a 6U-sized cold plate with a high thermal load of 100W. Aluminum, copper base materials, and groove-Type heat pipe embedded aluminum are selected as cold plate materials. As a result of these analyses, the desired performance can be obtained by keeping the performance of the heat pipes in aluminum above 1500 W/mK. As a result, it is possible to achieve a lighter cold plate design with high thermal conductivity, produced in one piece with additive manufacturing.

Original languageEnglish
Title of host publicationTHERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665492294
DOIs
Publication statusPublished - 2022
Event28th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2022 - Dublin, Ireland
Duration: 28 Sept 202230 Sept 2022

Publication series

NameTHERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Conference

Conference28th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2022
Country/TerritoryIreland
CityDublin
Period28/09/2230/09/22

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

Funding

ACKNOWLEDGMENT This study was supported by the internal fund of the Radar and Electronic Warfare Division of ASELSAN Inc.

FundersFunder number
Aselsan

    Keywords

    • Additive Manufacturing
    • Cold Plate
    • Electronic Cooling
    • Groove Type Heat Pipe
    • Heat Pipe Embedded Cold Plate

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