Impact of Oxidation on Pool Boiling Heat Transfer Performance over Flat Plates Exposed to Extended Operating Conditions

Tolga Emir, Mete Budakli, Mehmet Arik

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Phase change heat transfer is utilized in a number of high heat flux applications. In order to ensure reliable functionality at moderate temperatures, one has to guarantee a stable long-term operation. In this experimental study, boiling heat transfer (BHT) performances of several substrates under continuous operation at pre-determined heat fluxes were studied. Tests were performed on bare copper surfaces in saturated deionized (DI) water and HFE-7100 under atmospheric conditions. Measurements were conducted at heat fluxes of 30 W/cm2 and 60 W/cm2 for DI water, whereas at 6 W/cm2 and 12 W/cm2 for HFE-7100. In order to identify the temporal change in surface conditions for each substrate, subsequently repeated heating tests were conducted before a 24-hour operation at constant heat flux. Besides the computation of heat transfer coefficients, contact angle (CA) measurements, high-resolution microscopic images, and scanning electron microscope (SEM) analyses were carried out to characterize the impact over surfaces. Microscopic images showed that the use of DI water leads to an intensified oxidization on the test surface. HFE-7100 does not allow oxide layer formation on the copper surfaces. Critical heat flux (CHF) at the surface operated only at 60 W/cm2 in DI water increased, while the boiling curves shifted to the left by decreasing surface temperatures over time. The surfaces immersed in HFE-7100 showed a great consistency with preliminary tests on heat transfer and repeatability tests.

Original languageEnglish
Title of host publicationProceedings of the 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023
PublisherIEEE Computer Society
ISBN (Electronic)9798350321661
DOIs
Publication statusPublished - 2023
Externally publishedYes
Event22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023 - Orlando, United States
Duration: 30 May 20232 Jun 2023

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2023-May
ISSN (Print)1936-3958

Conference

Conference22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023
Country/TerritoryUnited States
CityOrlando
Period30/05/232/06/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

  • critical heat flux
  • dielectric liquids
  • heat transfer
  • pool boiling
  • surface oxidation

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