Enhanced interface structure of electroformed copper/diamond composites for thermal management applications

As the power density of electronic devices increases, the requirement for heat sinks with enhanced thermal properties becomes imperative for advanced heat dissipation. Copper/diamond composites are next-generation heat dissipators with high thermal conductivities, yet fabrication of these composites requires high energy and complex instruments. In this study, copper/diamond composites are fabricated by electroforming. The sediment co-deposition process is modified to obtain uniform diamond particle distribution with tailorable volume fraction. Diamond particles were initially settled on the cathode surface outside the electrolyte, and then the setup was immersed in an acidic copper sulfate electroforming bath. Varying amounts (0–100 mg l⁻¹) of thiourea are introduced to the electrolyte to enhance the matrix–particle interface. The gaps between diamond particles are filled with electrodeposited copper using optimized deposition conditions. The composite structure detaches from the cathode by itself after the production with desired shape and dimensions. The effect of operating conditions on cathodic polarization, composite microstructure, and thermal properties are investigated. Thermal conductivity of 49 vol.% diamond containing sample fabricated with optimized parameters exceeds 667 W m⁻¹ K⁻¹. The increase in thermal conductivity and enhanced interface structure is attributed to the excellent void-filling ability of the optimized electrolyte.