Development of an IT equipment lumped capacitance parameter database for transient data center simulations

Dustin W. Demetriou*, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Citations (Scopus)

Abstract

The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server's time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that proposed methodology to introduce a possible approach for developing an easy-to-use database of lumped capacitance characteristics for use in transient thermal simulations. The database will allow the user to select the appropriate transient parameters based on characteristics that do not require an autopsy of each-and-every server in the data center. Experiments are conducted to provide representative transient parameters which classify the servers by mass density and operating air flow rate. The paper describes the experimental methodology in detail to allow for the easy addition of other IT equipment or future server generations.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1330-1337
Number of pages8
ISBN (Electronic)9781479952670
DOIs
Publication statusPublished - 4 Sept 2014
Externally publishedYes
Event14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014 - Orlando, United States
Duration: 27 May 201430 May 2014

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Conference

Conference14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Country/TerritoryUnited States
CityOrlando
Period27/05/1430/05/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

Keywords

  • data center
  • energy efficiency
  • transient

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