TY - GEN
T1 - Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertanties due to 3D heat losses
AU - Arik, Mehmet
AU - Li, Ri
AU - Andreini, Kristian
AU - Crosby, Jared
AU - Shaddock, Dave
AU - Kizil, Huseyin
PY - 2010
Y1 - 2010
N2 - Thermal spreaders have been of interest over the last few decades. Heat pipes, Thermal Pyrolytic Graphite (TPG), and other graphite-based materials have been commonly used for enhancing the thermal performance. This study will start for a discussion of Chemical Vapor Deposition (CVD) of diamond manufacturing to enable high conductivity plates for heat spreading. Later attention will be turned to absolute thermal conductivity measurements. A measurement technique for the thermal conductivity of a thin diamond plate was proposed. Baseline measurements have been established via a similar copper plate with a thermal conductivity of 400 W/m-K. IR thermal images were collected. Heat losses are calculated via analytical and numerical models. We found that one type of thermal management CVD diamond has a thermal conductivity of approximately 820 W/m-K accounting both diamond film and thin Silicon substrate.
AB - Thermal spreaders have been of interest over the last few decades. Heat pipes, Thermal Pyrolytic Graphite (TPG), and other graphite-based materials have been commonly used for enhancing the thermal performance. This study will start for a discussion of Chemical Vapor Deposition (CVD) of diamond manufacturing to enable high conductivity plates for heat spreading. Later attention will be turned to absolute thermal conductivity measurements. A measurement technique for the thermal conductivity of a thin diamond plate was proposed. Baseline measurements have been established via a similar copper plate with a thermal conductivity of 400 W/m-K. IR thermal images were collected. Heat losses are calculated via analytical and numerical models. We found that one type of thermal management CVD diamond has a thermal conductivity of approximately 820 W/m-K accounting both diamond film and thin Silicon substrate.
UR - http://www.scopus.com/inward/record.url?scp=77955205795&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2010.5501258
DO - 10.1109/ITHERM.2010.5501258
M3 - Conference contribution
AN - SCOPUS:77955205795
SN - 9781424453429
T3 - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
BT - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
T2 - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Y2 - 2 June 2010 through 5 June 2010
ER -