Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Junghyun Park; Ignace Agbadan; Monsuru Dauda; Mustapha Bello; John Hendershot; Soundarzo Tasnim; Omotolani Oduyebo; Sunggook Park; Anthony Engler; Jaimal Williamson; Varughese Mathew; Cigdem Atalay-Oral; John Flake

doi:10.1149/2162-8777/ae170a

Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Junghyun Park
, Ignace Agbadan
, Monsuru Dauda
, Mustapha Bello
, John Hendershot
, Soundarzo Tasnim
, Omotolani Oduyebo
, Sunggook Park
, Anthony Engler
, Jaimal Williamson
, Varughese Mathew
, Cigdem Atalay-Oral
, John Flake^*

^*Corresponding author for this work

Louisiana State University
Louisiana State University
Texas Instruments
NXP Semiconductors

Research output: Contribution to journal › Article › peer-review

Abstract

Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW_0.66P_0.17 interface enhances adhesion due to its stable oxides. The CoW_0.66P_0.17 shows stability with a 0.02 dB mm⁻¹ S21 change after 1500 cycles.

Original language	English
Article number	111004
Journal	ECS Journal of Solid State Science and Technology
Volume	14
Issue number	11
DOIs	https://doi.org/10.1149/2162-8777/ae170a
Publication status	Published - 1 Nov 2025
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2025 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited.

Keywords

Chip-to-chip (C2C) interconnect
cladding
coupling agent
metal interlayer
multichip package
oxidation
polymer-metal adhesion

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10.1149/2162-8777/ae170a

Cite this

Park, J., Agbadan, I., Dauda, M., Bello, M., Hendershot, J., Tasnim, S., Oduyebo, O., Park, S., Engler, A., Williamson, J., Mathew, V., Atalay-Oral, C., & Flake, J. (2025). Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects. ECS Journal of Solid State Science and Technology, 14(11), Article 111004. https://doi.org/10.1149/2162-8777/ae170a

@article{5be185821bbd4e87a6f54609ffee3775,

title = "Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects",

abstract = "Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.",

keywords = "Chip-to-chip (C2C) interconnect, cladding, coupling agent, metal interlayer, multichip package, oxidation, polymer-metal adhesion",

author = "Junghyun Park and Ignace Agbadan and Monsuru Dauda and Mustapha Bello and John Hendershot and Soundarzo Tasnim and Omotolani Oduyebo and Sunggook Park and Anthony Engler and Jaimal Williamson and Varughese Mathew and Cigdem Atalay-Oral and John Flake",

note = "Publisher Copyright: {\textcopyright} 2025 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited.",

year = "2025",

month = nov,

day = "1",

doi = "10.1149/2162-8777/ae170a",

language = "English",

volume = "14",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

publisher = "Electrochemical Society Inc.",

number = "11",

}

TY - JOUR

T1 - Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

AU - Park, Junghyun

AU - Agbadan, Ignace

AU - Dauda, Monsuru

AU - Bello, Mustapha

AU - Hendershot, John

AU - Tasnim, Soundarzo

AU - Oduyebo, Omotolani

AU - Park, Sunggook

AU - Engler, Anthony

AU - Williamson, Jaimal

AU - Mathew, Varughese

AU - Atalay-Oral, Cigdem

AU - Flake, John

PY - 2025/11/1

Y1 - 2025/11/1

N2 - Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.

AB - Highlights The Cu-epoxy interface performance is studied over 1500 temperature cycles. The temperature stability of organic and metal interlayers is studied for Cu-epoxy. Organic adhesion promoters, such as silane and azole, improve initial adhesion. Electroless CoW0.66P0.17 interface enhances adhesion due to its stable oxides. The CoW0.66P0.17 shows stability with a 0.02 dB mm−1 S21 change after 1500 cycles.

KW - Chip-to-chip (C2C) interconnect

KW - cladding

KW - coupling agent

KW - metal interlayer

KW - multichip package

KW - oxidation

KW - polymer-metal adhesion

UR - https://www.scopus.com/pages/publications/105033915869

U2 - 10.1149/2162-8777/ae170a

DO - 10.1149/2162-8777/ae170a

M3 - Article

AN - SCOPUS:105033915869

SN - 2162-8769

VL - 14

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 11

M1 - 111004

ER -

Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects

Abstract

Bibliographical note

Keywords

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