Coarse-grained simulation of thermal conductivity of boron nitride/epoxy composites based on DPD and SPH method

Xueming Yang*, Xiaozhong Zhang, Tianfu Yu, Yi Li, Mesut Kirca

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Coarse-grained simulation of thermal conductivity of boron nitride/epoxy composites based on DPD and SPH method'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science

Chemical Engineering