Assessment of the energy performance of cogeneration systems for powering and cooling data centers

Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The Syracuse/IBM Green Data Center utilizes micro turbines in combination with exhaust fired heat exchangers and absorption chillers to produce electrical power, cooling and heating for the data center and surrounding infrastructure. The overall efficiency of cogeneration systems depend greatly on the utilization of turbine exhaust heat. This makes a data center (where cooling load and electrical power requirements are closely correlated) an excellent candidate for cogeneration technology. Over 200 data points collected in the data center allow for in-depth energy analysis of this unique data center and the surrounding infrastructure. This paper provides information on the Syracuse/IBM Green Data Center systems as well as analysis of the data center over all four seasons. In addition to PUE, the common data center metric, a new metric defined as ERE1 is used to measure data center efficiency when energy is exported to the surrounding infrastructure.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
Publication statusPublished - 2013
Externally publishedYes
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: 16 Jul 201318 Jul 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume2

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period16/07/1318/07/13

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