An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Aziz Koyuncuoğlu; Göker Türkakar; Matthew Redmond; Tuba Okutucu-özyurt; Haluk Külah; Satish Kumar

doi:10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Aziz Koyuncuoğlu, Göker Türkakar, Matthew Redmond, Tuba Okutucu-özyurt, Haluk Külah, Satish Kumar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm^2·K/W with a corresponding heat flux of 128.5 W/cm² and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

Original language	English
Title of host publication	Proceedings of CONV-14
Subtitle of host publication	International Symposium on Convective Heat and Mass Transfer, 2014
Publisher	Begell House Inc.
Pages	941-952
Number of pages	12
ISBN (Print)	9781567003567
DOIs	https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700
Publication status	Published - 2014
Externally published	Yes
Event	International Symposium on Convective Heat and Mass Transfer, CONV 2014 - Kusadasi, Turkey Duration: 8 Jun 2014 → 13 Jun 2014

Publication series

Name	International Symposium on Advances in Computational Heat Transfer
ISSN (Print)	2578-5486

Conference

Conference	International Symposium on Convective Heat and Mass Transfer, CONV 2014
Country/Territory	Turkey
City	Kusadasi
Period	8/06/14 → 13/06/14

Bibliographical note

Publisher Copyright:
© 2014, Begell House Inc. All rights reserved.

Funding

This research has been financially supported by the Scientific and Technological Research Council of Turkey under grant number TÜBİTAK 108M515. The third author is a visiting researcher in Turkey on Fulbright scholarship. This research has been financially supported by the Scientific and Council of Turkey under grant number TÜBİTAK 108M515. The researcher in Turkey on Fulbrightscholarship.

Funders	Funder number
Council of Turkey
Türkiye Bilimsel ve Teknolojik Araştirma Kurumu	TÜBİTAK 108M515

Keywords

CMOS compatible
Chip cooling
Figure of merit, thermal resistance minimization
Microchannel heat sink
Monolithic design

Access to Document

10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

Cite this

Koyuncuoğlu, A., Türkakar, G., Redmond, M., Okutucu-özyurt, T., Külah, H., & Kumar, S. (2014). An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. In Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014 (pp. 941-952). (International Symposium on Advances in Computational Heat Transfer). Begell House Inc.. https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

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title = "An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks",

abstract = "A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.",

keywords = "CMOS compatible, Chip cooling, Figure of merit, thermal resistance minimization, Microchannel heat sink, Monolithic design",

author = "Aziz Koyuncuoğlu and G{\"o}ker T{\"u}rkakar and Matthew Redmond and Tuba Okutucu-{\"o}zyurt and Haluk K{\"u}lah and Satish Kumar",

note = "Publisher Copyright: {\textcopyright} 2014, Begell House Inc. All rights reserved.; International Symposium on Convective Heat and Mass Transfer, CONV 2014 ; Conference date: 08-06-2014 Through 13-06-2014",

year = "2014",

doi = "10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700",

language = "English",

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Koyuncuoğlu, A, Türkakar, G, Redmond, M, Okutucu-özyurt, T, Külah, H & Kumar, S 2014, An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. in Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. International Symposium on Advances in Computational Heat Transfer, Begell House Inc., pp. 941-952, International Symposium on Convective Heat and Mass Transfer, CONV 2014, Kusadasi, Turkey, 8/06/14. https://doi.org/10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. / Koyuncuoğlu, Aziz; Türkakar, Göker; Redmond, Matthew et al.
Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. Begell House Inc., 2014. p. 941-952 (International Symposium on Advances in Computational Heat Transfer).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Türkakar, Göker

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AU - Külah, Haluk

AU - Kumar, Satish

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N2 - A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

AB - A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 µm by 50 µm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

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Koyuncuoğlu A, Türkakar G, Redmond M, Okutucu-özyurt T, Külah H, Kumar S. An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks. In Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer, 2014. Begell House Inc. 2014. p. 941-952. (International Symposium on Advances in Computational Heat Transfer). doi: 10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700

An experimental study on performance enhancement of cmos compatible monolithic microchannel heat sinks

Abstract

Publication series

Conference

Bibliographical note

Funding

Keywords

Access to Document

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Cite this