An experimental investigation into frost accumulation over vertical finned and unfinned surfaces during impinging air flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Frost formation on evaporators negatively affects the cooling performance of refrigerators. It increases the thermal resistance between the refrigerant and air leading to a reduction in the system cooling capacity. In this study, the effect of frost accumulation over a bare and finned surface on the convective thermal resistances has been experimentally investigated under impinging flow conditions. The surfaces are vertically positioned in a horizontal wind tunnel. The convective resistances have been measured with an in-house developed heat flux measurement system. Finally, the effectiveness of the finned surface was derived from the measurements for dry, condensing flow and as well as for frosting conditions. Under frosting conditions, the effectiveness of the finned surface is measured as 1.4 that is by a factor of 2X lower compared to the effectiveness of the same finned surface operating under dry conditions. It has been observed that the frost accumulation initially takes place at the tip of the fins and leads to a 45% drop in the heat transfer rate when the fin tips are completely covered with frost. Further frost accumulation on the fin base does not result in an additional drop in the heat transfer rate. In this regard, the study emphasizes the importance of the fin tip design for the heat sinks operating under frosting conditions.

Original languageEnglish
Title of host publicationASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791884041
DOIs
Publication statusPublished - 2020
Externally publishedYes
EventASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020 - Virtual, Online
Duration: 27 Oct 202029 Oct 2020

Publication series

NameASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020

Conference

ConferenceASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
CityVirtual, Online
Period27/10/2029/10/20

Bibliographical note

Publisher Copyright:
Copyright © 2020 ASME.

Keywords

  • Electronics cooling
  • Forced convection
  • Frost
  • Heat flux
  • Thermal resistance

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