Abstract
This article reports a test chip design in commercial 40-nm process technology to characterize the level of time-based degradation in metal-oxide-semiconductor field-effect transistors (MOSFETs). The two phenomena that have been concentrated on are the bias temperature instability (BTI) and the hot carrier injection (HCI). Stress tests have been carried out on both n- and p-MOSFETs with large channel widths and shorter channel lengths, as practically observed in analog and radio frequency circuits. Reliability characterization has been extended to cover the body effect and the impact of process variations both at prestress and poststress stages. The results demonstrate that the designed test chip has been instrumental in observing the extent of degradation due to BTI and HCI. Furthermore, both the body effect and the poststress variability have been found to affect the transistor and circuit performance significantly.
| Original language | English |
|---|---|
| Article number | 9458293 |
| Journal | IEEE Transactions on Instrumentation and Measurement |
| Volume | 70 |
| DOIs | |
| Publication status | Published - 2021 |
Bibliographical note
Publisher Copyright:© 1963-2012 IEEE.
Funding
Manuscript received March 1, 2021; revised June 5, 2021; accepted June 8, 2021. Date of publication June 17, 2021; date of current version July 13, 2021. This work was supported by the Technological Research Council of Turkey under the project TÜB˙TAK 1001 118E253. The Associate Editor coordinating the review process was Zhengyu Peng. (Corresponding author: Mustafa Berke Yelten.) The authors are with the Department of Electronics and Communications Engineering, Istanbul Technical University, 34467 Istanbul, Turkey (e-mail: [email protected]; [email protected]; [email protected]; [email protected]; [email protected]). Digital Object Identifier 10.1109/TIM.2021.3090175
| Funders | Funder number |
|---|---|
| Technological Research Council of Turkey | TÜB˙TAK 1001 118E253 |
Keywords
- Analog
- bias temperature instability (BTI)
- body effect
- hot carrier injection (HCI)
- integrated circuits
- process variations
- reliability
- test chip
- variability
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