A predictive model for wafer probe burn phenomenon

Baha Zafer*, Bahad Ir Tunaboylu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


Coupled thermal-electric computational mechanics techniques have been developed to understand the temperature distribution along a special design spring and cantilever probe body in order to model the probe burn phenomenon for conduction. The experimental maximum current carrying capability tests have been performed and compared with numerical solutions. Reasonably good agreement was observed between experimental and numerical results. A predictive model was developed as a design tool to enable faster probe design for cantilever or vertical types, assembly and test cycle for a wafer sort environment. In addition to the first mode, transient heat transfer between a heated spring probe and its close environment is investigated. A continuum finite volume simulation is used to analyze the heat flow within and from the resistively heated probe to its environment. Experimental results are conducted for spring probe with laminar air flow and without air flow. The numerical and experimental results are compared and high similarity is observed.

Original languageEnglish
Pages (from-to)610-616
Number of pages7
JournalApplied Thermal Engineering
Publication statusPublished - 5 Apr 2016
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2015 Elsevier Ltd. All rights reserved.


This research was supported by a Marie Curie International Reintegration Grant within the European Union Seventh Framework Programme under grant # 271545 . We also thank SV Probe Inc. R&D members for the discussions and contributions in this study.

FundersFunder number
Seventh Framework Programme271545


    • Joule heating
    • Numerical simulation
    • Probe burn
    • Vertical spring probe
    • Wafer probe


    Dive into the research topics of 'A predictive model for wafer probe burn phenomenon'. Together they form a unique fingerprint.

    Cite this