3D printable CNTs and BN hybridized PEEK composites for thermal management applications

Yunus Emre Bozkurt; Uğur Emanetoğlu; Alptekin Yıldız; Özlem Türkarslan; Feride N. Şaşal; Hulya Cebeci

doi:10.1007/s10853-023-08923-4

3D printable CNTs and BN hybridized PEEK composites for thermal management applications

Yunus Emre Bozkurt
, Uğur Emanetoğlu
, Alptekin Yıldız
, Özlem Türkarslan
, Feride N. Şaşal
, Hulya Cebeci^*

^*Corresponding author for this work

Istanbul Technical University
Boeing Research and Technology

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.% CNTs/ 30 wt.% m-BN, and 1.77 W/mK with 40 wt.% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in T_g. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.

Original language	English
Pages (from-to)	15086-15099
Number of pages	14
Journal	Journal of Materials Science
Volume	58
Issue number	38
DOIs	https://doi.org/10.1007/s10853-023-08923-4
Publication status	Published - Oct 2023

Bibliographical note

Publisher Copyright:
© 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.

Funding

This work was supported by the Boeing Company, USA (2019000191). The author Dr. Alptekin Yıldız was supported by ITU BAP Division with project number MAB-2019-42010. The authors thank Suat Ebil from ITU Aerospace Research Center (ITU ARC) and Asst. Prof. Nuri Solak and Cem Kıncal for their contribution to the study and the thermal conductivity measurements. This work was supported by the Boeing Company, USA (2019000191). The author Dr. Alptekin Yıldız was supported by ITU BAP Division with project number MAB-2019-42010. The authors thank Suat Ebil from ITU Aerospace Research Center (ITU ARC) and Asst. Prof. Nuri Solak and Cem Kıncal for their contribution to the study and the thermal conductivity measurements.

Funders	Funder number
ITU Aerospace Research Center
ITU BAP Division	MAB-2019-42010
Boeing	2019000191

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Access to Document

10.1007/s10853-023-08923-4

Cite this

@article{1e69ffcdd12a4765900c7f2e26fe3b1f,

title = "3D printable CNTs and BN hybridized PEEK composites for thermal management applications",

abstract = "Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.\% CNTs/ 30 wt.\% m-BN, and 1.77 W/mK with 40 wt.\% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in Tg. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.",

author = "Bozkurt, \{Yunus Emre\} and Uğur Emanetoğlu and Alptekin Yıldız and {\"O}zlem T{\"u}rkarslan and {\c S}a{\c s}al, \{Feride N.\} and Hulya Cebeci",

note = "Publisher Copyright: {\textcopyright} 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.",

year = "2023",

month = oct,

doi = "10.1007/s10853-023-08923-4",

language = "English",

volume = "58",

pages = "15086--15099",

journal = "Journal of Materials Science",

issn = "0022-2461",

number = "38",

}

TY - JOUR

T1 - 3D printable CNTs and BN hybridized PEEK composites for thermal management applications

AU - Bozkurt, Yunus Emre

AU - Emanetoğlu, Uğur

AU - Yıldız, Alptekin

AU - Türkarslan, Özlem

AU - Şaşal, Feride N.

AU - Cebeci, Hulya

PY - 2023/10

Y1 - 2023/10

N2 - Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.% CNTs/ 30 wt.% m-BN, and 1.77 W/mK with 40 wt.% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in Tg. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.

AB - Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.% CNTs/ 30 wt.% m-BN, and 1.77 W/mK with 40 wt.% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in Tg. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.

UR - https://www.scopus.com/pages/publications/85173110859

U2 - 10.1007/s10853-023-08923-4

DO - 10.1007/s10853-023-08923-4

M3 - Article

AN - SCOPUS:85173110859

SN - 0022-2461

VL - 58

SP - 15086

EP - 15099

JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 38

ER -

3D printable CNTs and BN hybridized PEEK composites for thermal management applications

Abstract

Bibliographical note

Funding

UN SDGs

Access to Document

Other files and links

Fingerprint

Cite this